[API] response: [200 OK] "{\"code\":200,\"msg\":\"success\",\"data\":{\"id\":220,\"parent_id\":2047,\"name\":\"Adhesives, Epoxies, Greases, Pastes\",\"path\":\"0;16;2047;220;\",\"product_count\":605,\"slug_name\":\"adhesives-epoxies-greases-pastes\",\"description\":\"Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of whi (truncated) ... [elapsed: 0.241412 secs]
[API] response: [200 OK] "{\"code\":200,\"msg\":\"success\",\"data\":{\"id\":220,\"parent_id\":2047,\"name\":\"Adhesives, Epoxies, Greases, Pastes\",\"path\":\"0;16;2047;220;\",\"product_count\":605,\"slug_name\":\"adhesives-epoxies-greases-pastes\",\"description\":\"Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of whi (truncated) ... [elapsed: 0.21764 secs]
[API] response: [200 OK] "{\"code\":200,\"msg\":\"success\",\"data\":{\"id\":16,\"parent_id\":0,\"name\":\"Fans, Blowers, Thermal Management\",\"path\":\"0;16;\",\"product_count\":156823,\"slug_name\":\"fans-thermal-management\",\"description\":\"The fan and thermal management category includes products and materials used to facilitate heat transfer and/or air movement, and accessories related to such products. Along with AC and DC fans and heat sinks, thermally-conductive adhesives, thermal interface products, heat pip (truncated) ... [elapsed: 0.218791 secs]
[API] response: [200 OK] "{\"code\":200,\"msg\":\"success\",\"data\":{\"id\":220,\"parent_id\":2047,\"name\":\"Adhesives, Epoxies, Greases, Pastes\",\"path\":\"0;16;2047;220;\",\"product_count\":605,\"slug_name\":\"adhesives-epoxies-greases-pastes\",\"description\":\"Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of whi (truncated) ... [elapsed: 0.229266 secs]
